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Radial Lead Fuses
Introduction to Circuit Protection
> 399 Series
TE5 ? > Time-Lag Transientology
Temperature Rerating Curve
Average Time Current Curves
100000
10000
1000
100
10
1
0.100
0.010
0.001
0.20
1
10
100
1000
CURRENT IN AMPERES
Soldering Parameters - Wave Soldering
300
280
260
Recommended Process Parameters:
2 4 0
220
200
180
160
1 4 0
120
100
80
60
4 0
20
0
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100 ° C
150 ° C
60-180 seconds
260 ° C Maximum
2-5 seconds
T ime (Seconds)
Recommended Hand-Solder Parameters:
Preheat T ime
Dwell T ime
Cooling T ime
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Re?ow process.
399 Series
196
Revised: January 7, 2009
? 2009 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/399.html for current information.
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